Two-component epoxy potting glue
[Product information] Two-component epoxy resin potting material has excellent aging resistance, moisture resistance, electrical insulation, high hardness and high breakdown voltage. Suitable for all kinds of casting bonding and sealing of electronic components. Huayu epoxy electronic potting glue is self-leveling and solidifies at room temperature. The varieties are as follows:
HY484P general-purpose epoxy potting glue: used for potting of general electronic components and circuit board sealing protection.
HY484T transparent epoxy potting glue: potting of electronic components and modules with transparent requirements, suitable for the potting of digital tubes at room temperature.
HY484D thermally conductive epoxy potting glue: used for potting protection of modules and circuit boards that require high heat dissipation for high-power electronic components.
HY484Z flame-retardant epoxy potting glue: used for potting of electronic components and circuit boards that require flame-retardant.
HY485 Elastomer epoxy potting glue: used for potting of electronic components and circuit boards with elastic requirements.
